Invention Application
US20140093721A1 HIGH-TEMPERATURE-RESISTANT FOAMS HAVING LOW THERMAL CONDUCTIVITY
审中-公开
具有低导热性的高温抗菌功能
- Patent Title: HIGH-TEMPERATURE-RESISTANT FOAMS HAVING LOW THERMAL CONDUCTIVITY
- Patent Title (中): 具有低导热性的高温抗菌功能
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Application No.: US14114987Application Date: 2012-04-27
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Publication No.: US20140093721A1Publication Date: 2014-04-03
- Inventor: Dirk Wegener , Stephen Reiter , Harald Rasselnberg , Marcel Schornstein , Hans-Detlef Arntz , Dirk Brüning
- Applicant: Dirk Wegener , Stephen Reiter , Harald Rasselnberg , Marcel Schornstein , Hans-Detlef Arntz , Dirk Brüning
- Applicant Address: DE Monheim
- Assignee: Bayer Intellectual Property GmbH
- Current Assignee: Bayer Intellectual Property GmbH
- Current Assignee Address: DE Monheim
- Priority: DE102011075079.7 20110502
- International Application: PCT/EP2012/057847 WO 20120427
- Main IPC: C08G18/08
- IPC: C08G18/08 ; C08G18/06
Abstract:
The invention relates to high-temperature-resistant foams having low thermal conductivity, to the production thereof from organic polyisocyanates and polyepoxides, and to the use of the foams.
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