Invention Application
- Patent Title: Modular Patch Panel System
- Patent Title (中): 模块化配线架系统
-
Application No.: US13632238Application Date: 2012-10-01
-
Publication No.: US20140094057A1Publication Date: 2014-04-03
- Inventor: Samuel C. Ramey , Frank J. Graczyk , Samuel M. Marrs
- Applicant: PANDUIT CORP.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Main IPC: H01R13/60
- IPC: H01R13/60
Abstract:
A modular patch panel system is provided and includes a patch panel frame, a data module removably connected to the patch panel frame, and a power module removably connected to the patch panel frame.
Information query
