发明申请
- 专利标题： Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- 专利标题（中）： 导电载体集成散热器半导体封装
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申请号： US14022584申请日： 2013-09-10
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公开(公告)号： US20140110796A1公开(公告)日： 2014-04-24
- 发明人: Eung San Cho , Andrew N. Sawle , Mark Pavier , Daniel Cutler
- 申请人： International Rectifier Corporation
- 申请人地址： US CA El Segundo
- 专利权人： International Rectifier Corporation
- 当前专利权人： International Rectifier Corporation
- 当前专利权人地址： US CA El Segundo
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48
摘要：
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the semiconductor package to a mounting surface. The semiconductor package also includes a control FET of a power converter switching stage having a control drain attached to the die side of the control conductive carrier. The control conductive carrier is configured to sink heat produced by the control FET into the mounting surface. The semiconductor package includes a sync conductive carrier having another die side and another opposite I/O side connecting the semiconductor package to the mounting surface, and a sync FET of the power converter switching stage having a sync source attached to the die side of the sync conductive carrier.
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