发明申请
- 专利标题： HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- 专利标题（中）： 高性能互连物理层
-
申请号： US13976919申请日： 2013-03-15
-
公开(公告)号： US20140114887A1公开(公告)日： 2014-04-24
- 发明人: Venkatraman Iyer , Darren S. Jue , Sitaraman V. Iyer
- 申请人： Venkatraman Iyer , Darren S. Jue , Sitaraman V. Iyer
- 国际申请： PCT/US13/32699 WO 20130315
- 主分类号： G06N99/00
- IPC分类号： G06N99/00
摘要：
A set of training sequences is generated, each training sequence to include a respective training sequence header, and the training sequence header is to be DC-balanced over the set of training sequences. The set of training sequences can be combined with electric ordered sets to form supersequences for use in such tasks as link adaptation, link state transitions, byte lock, deskew, and other tasks.
公开/授权文献
- US09600431B2 High performance interconnect physical layer 公开/授权日：2017-03-21