发明申请
- 专利标题: HYBRID INTEGRATED COMPONENT
- 专利标题(中): 混合集成组件
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申请号: US14059202申请日: 2013-10-21
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公开(公告)号: US20140117475A1公开(公告)日: 2014-05-01
- 发明人: Johannes CLASSEN , Axel FRANKE , Jens FREY , Heribert WEBER , Frank FISCHER , Patrick WELLNER , Mirko HATTASS , Daniel Christoph MEISEL
- 申请人: Johannes CLASSEN , Axel FRANKE , Jens FREY , Heribert WEBER , Frank FISCHER , Patrick WELLNER , Mirko HATTASS , Daniel Christoph MEISEL
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 优先权: DE102012219550.5 20121025
- 主分类号: B81B7/00
- IPC分类号: B81B7/00
摘要:
A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.
公开/授权文献
- US09266720B2 Hybrid integrated component 公开/授权日:2016-02-23