Invention Application
- Patent Title: TWO-DIMENSIONAL TRANSMIT POWER COMPENSATION
- Patent Title (中): 二维发射功率补偿
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Application No.: US13952902Application Date: 2013-07-29
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Publication No.: US20140119216A1Publication Date: 2014-05-01
- Inventor: Shrenik Patel , Orhan C. Ozdural , Wei-Hao Lin , Pritesh Vora
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W52/24
- IPC: H04W52/24

Abstract:
Exemplary embodiments are related to two-dimensional maximum power compensation. A method may include calibrating an output power level of a transmitter across a range of frequencies at a constant temperature. The method may further include characterizing the output power level of the transmitter for each temperature of a plurality of temperatures for each frequency of the range of frequencies.
Public/Granted literature
- US09185659B2 Two-dimensional transmit power compensation Public/Granted day:2015-11-10
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