Invention Application
US20140134429A1 Techniques for Marking a Substrate Using a Physical Vapor Deposition Material 审中-公开
使用物理气相沉积材料标记基材的技术

Techniques for Marking a Substrate Using a Physical Vapor Deposition Material
Abstract:
Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Information query
Patent Agency Ranking
0/0