Invention Application
US20140134429A1 Techniques for Marking a Substrate Using a Physical Vapor Deposition Material
审中-公开
使用物理气相沉积材料标记基材的技术
- Patent Title: Techniques for Marking a Substrate Using a Physical Vapor Deposition Material
- Patent Title (中): 使用物理气相沉积材料标记基材的技术
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Application No.: US14161493Application Date: 2014-01-22
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Publication No.: US20140134429A1Publication Date: 2014-05-15
- Inventor: DOUGLAS WEBER , Christopher Prest , David Pakula , Stephen Paul Zadesky
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C23C14/02 ; B32B15/04

Abstract:
Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Public/Granted literature
- US09849650B2 Techniques for marking a substrate using a physical vapor deposition material Public/Granted day:2017-12-26
Information query
IPC分类: