发明申请
- 专利标题: PROCESSING APPARATUS AND PROCESSING METHOD
- 专利标题(中): 加工设备和加工方法
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申请号: US14127828申请日: 2012-08-07
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公开(公告)号: US20140137711A1公开(公告)日: 2014-05-22
- 发明人: Tasuku Horie , Shuho Tsubota , Katsuya Sennyu , Hiroshi Hara
- 申请人: Tasuku Horie , Shuho Tsubota , Katsuya Sennyu , Hiroshi Hara
- 优先权: JP2011-175939 20110811
- 国际申请: PCT/JP2012/070102 WO 20120807
- 主分类号: B23Q3/06
- IPC分类号: B23Q3/06 ; B23B5/00
摘要:
A processing apparatus and a processing method with which an object-to-be-cut is processed, and a high-precision superconducting acceleration cavity can be formed. The processing apparatus forming a half cell by processing a hollow workpiece, and is provided with a securing jig, a rotational drive portion rotating the securing jig, and a cutting tool. The securing jig having a plurality of members, when cutting a first portion-to-be-cut of the workpiece, the plurality of members are combined in a first pattern so that the first portion-to-be-cut is exposed, when cutting a second portion-to-be-cut of the workpiece, the plurality of members are combined in a second pattern so that the second portion-to-be-cut is exposed, and the combination of the plurality of members is changed from the first pattern to the second pattern without removing the workpiece.
公开/授权文献
- US10035229B2 Processing apparatus and processing method 公开/授权日:2018-07-31
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