发明申请
- 专利标题： SEMICONDUCTOR DEVICE BONDED BY ANISOTROPIC CONDUCTIVE FILM
- 专利标题（中）： 由各向异性导电膜接合的半导体器件
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申请号： US14084741申请日： 2013-11-20
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公开(公告)号： US20140138828A1公开(公告)日： 2014-05-22
- 发明人: Do Hyun PARK , Kyu Bong KIM , Woo Jun LIM
- 申请人： Do Hyun PARK , Kyu Bong KIM , Woo Jun LIM
- 优先权： KR10-2012-0131289 20121120
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.
公开/授权文献
- US09142525B2 Semiconductor device bonded by anisotropic conductive film 公开/授权日：2015-09-22
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