Invention Application
- Patent Title: GEL-FORMING DEVICE
- Patent Title (中): 凝胶成型装置
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Application No.: US13861275Application Date: 2013-04-11
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Publication No.: US20140141504A1Publication Date: 2014-05-22
- Inventor: Sang Hyun YI , Dong Woo LEE , Bo Sung KU
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0131528 20121120
- Main IPC: C12M1/12
- IPC: C12M1/12

Abstract:
There is provided a gel-forming device including a housing providing an inner space and having one opened side, a support plate disposed on one opened side of the housing and including at least one through-hole passing through the top and the bottom thereof, a substrate disposed on the top of the support plate and including at least one protrusion protruding from one surface thereof so as to have a biomaterial disposed thereon, and a spacing member provided on the bottom of the support plate so as to allow the support plate and the housing to be spaced apart from each other by a predetermined interval.
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