发明申请
- 专利标题： POLYMERIZATION METHOD OF HIGH-MOLECULAR WEIGHT COMPOUND, RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN
- 专利标题（中）： 高分子量化合物的聚合方法，耐蚀组合物和形成耐蚀图案的方法
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申请号： US14086092申请日： 2013-11-21
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公开(公告)号： US20140147792A1公开(公告)日： 2014-05-29
- 发明人: Takahiro Dazai , Masatoshi Arai , Yoshiyuki Utsumi
- 申请人： Tokyo Ohka Kogyo Co., Ltd.
- 申请人地址： JP Kawasaki-shi
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2012-258904 20121127; JP2013-041067 20130301
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/20 ; C08F2/06
摘要：
A polymerization method of a high-molecular weight compound (A1) having a constituent unit (a0) derived from a compound represented by the following general formula (a0-1), which has excellent lithography properties, and is useful as a resist composition, the method including conducting polymerization using a mixed solvent containing 10 mass % or more of one or more of a cyclic ketone-based solvent, an ester-based solvent, and a lactone-based solvent. A resist composition containing the high-molecular weight compound (A1) and a method for forming a resist pattern using the same.
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