Invention Application
- Patent Title: HEATING PHASE CHANGE MATERIAL
- Patent Title (中): 加热相变材料
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Application No.: US14167122Application Date: 2014-01-29
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Publication No.: US20140147965A1Publication Date: 2014-05-29
- Inventor: Guy C. Wicker , Fabio Pellizzer , Enrico Varesi , Agostino Pirovano
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heating.
Public/Granted literature
- US09343676B2 Heating phase change material Public/Granted day:2016-05-17
Information query
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