发明申请
US20140151682A1 CIRCUIT BOARD, DISPLAY DEVICE, AND PROCESS FOR PRODUCTION OF CIRCUIT BOARD
审中-公开
电路板，显示装置及电路板生产工艺
- 专利标题： CIRCUIT BOARD, DISPLAY DEVICE, AND PROCESS FOR PRODUCTION OF CIRCUIT BOARD
- 专利标题（中）： 电路板，显示装置及电路板生产工艺
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申请号： US13810113申请日： 2011-04-13
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公开(公告)号： US20140151682A1公开(公告)日： 2014-06-05
- 发明人: Yuichi Saito , Yohsuke Kanzaki , Yudai Takanishi , Tetsuya Okamoto , Yoshiki Nakatani , Yoshimasa Chikama
- 申请人： Yuichi Saito , Yohsuke Kanzaki , Yudai Takanishi , Tetsuya Okamoto , Yoshiki Nakatani , Yoshimasa Chikama
- 申请人地址： JP Osaka-shi, Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka-shi, Osaka
- 优先权： JP2010-161077 20100715
- 国际申请： PCT/JP2011/059198 WO 20110413
- 主分类号： H01L29/786
- IPC分类号： H01L29/786 ; H01L27/12 ; H01L29/66
摘要：
The present invention provides a circuit board having excellent productivity, particularly a circuit board having excellent productivity with respect to a semiconductor layer and source layer forming step, a display device, and a process for producing a circuit board. The circuit board of the present invention is a circuit board including an oxide semiconductor layer and an electrode connected to the oxide semiconductor layer, wherein the electrode is formed by essentially laminating a layer made of a metal other than copper and a layer containing copper.
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