发明申请
- 专利标题: ADHESIVE COMPOSITION, ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM
- 专利标题(中): 胶粘组合物,胶粘剂,粘合膜和导线
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申请号: US14103131申请日: 2013-12-11
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公开(公告)号: US20140158413A1公开(公告)日: 2014-06-12
- 发明人: Daisuke SHANAI , Takashi Aoyama , Kazuhiko Sasada , Hiroaki Komatsu
- 申请人: HITACHI METALS, LTD.
- 申请人地址: JP Tokyo
- 专利权人: HITACHI METALS, LTD.
- 当前专利权人: HITACHI METALS, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2012-271140 20121212; JP2013-213268 20131011
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; C09J171/08 ; C09J7/02 ; H05K1/09
摘要:
An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.
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