发明申请
- 专利标题： PACKAGING STRUCTURE FOR PATCHES
- 专利标题（中）： 包装的包装结构
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申请号： US14232358申请日： 2012-07-13
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公开(公告)号： US20140158571A1公开(公告)日： 2014-06-12
- 发明人: Kensuke Matsuoka , Yoshihiro Iwao , Jun Harima , Masakatsu Konno , Kazuhiro Aoyagi , Tomoya Tanaka , Mikio Toyota , Yasuhiko Akita , Tadashi Matsui
- 申请人： Kensuke Matsuoka , Yoshihiro Iwao , Jun Harima , Masakatsu Konno , Kazuhiro Aoyagi , Tomoya Tanaka , Mikio Toyota , Yasuhiko Akita , Tadashi Matsui
- 申请人地址： JP Tokyo JP Osaka
- 专利权人： TOA EIYO LTD.,NITTO DENKO CORPORATION
- 当前专利权人： TOA EIYO LTD.,NITTO DENKO CORPORATION
- 当前专利权人地址： JP Tokyo JP Osaka
- 优先权： JP2011-156771 20110715
- 国际申请： PCT/JP2012/068001 WO 20120713
- 主分类号： A61J1/00
- IPC分类号： A61J1/00
摘要：
A packaging structure (100) for a patch includes a first and second base materials (120, 130) which have a peripheral edge part laminated with each other, and the patch is included therein. The first and second base materials (120, 130) have a first to forth sides (121 to 124, 131-134). At least one of the first and second base materials (120, 130) has a first to third opening parts (125 to 127, 135 to 137). The first to third opening parts (125 to 127, 135 to 137) guides so as to open toward the inner peripheral edge (120c1, 120c2, 120c4, 130c1, 130c2, 130c4) of the sealing part (120c, 130c).
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