A high-frequency module includes a high-frequency circuit chip, a wiring board having a wiring unit including connection pads which are flip-chip-connected to input and output terminals of the high-frequency circuit chip via bumps, a measurement circuit element that is disposed on a surface, opposed to the wiring board, of the high-frequency circuit chip and is connected between at least two terminals, connected to connection pads of the wiring unit, of the input and output terminals, or that is disposed on a surface, opposed to the high-frequency circuit chip, of the wiring board and is connected to the connection pads, and a detection conductor that is disposed on the high-frequency circuit chip or the wiring board at such a position as to be opposed to the measurement circuit element.