发明申请
- 专利标题： PACKAGE
- 专利标题（中）： 包
-
申请号： US13959666申请日： 2013-08-05
-
公开(公告)号： US20140160689A1公开(公告)日： 2014-06-12
- 发明人: Dong Min KANG , Chull Won Ju , Seong-Il Kim , Sang-Heung Lee , Jong-Won Lim , Hyung Sup Yoon , Jae Kyoung Mun , Eun Soo Nam
- 申请人： Electronics and Telecommunications Research Institute
- 申请人地址： KR Daejeon
- 专利权人： Electronics and Telecommunications Research Institute
- 当前专利权人： Electronics and Telecommunications Research Institute
- 当前专利权人地址： KR Daejeon
- 优先权： KR10-2012-0144129 20121212
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
A package includes a ground plate, a chip mounting plate disposed at a side of the ground plate and having a top surface lower than a top surface of the ground plate, a chip on the chip mounting plate, a first input/output terminal opposite to the chip mounting plate and disposed at another side of the ground plate, and a second input/output terminal opposite to the ground plate and disposed at a side of the chip mounting plate. The first and second input/output terminals are electrically connected to the chip.