发明申请
- 专利标题： Current Sensor Substrate and Current Sensor
- 专利标题（中）： 电流传感器基板和电流传感器
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申请号： US14131723申请日： 2012-07-11
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公开(公告)号： US20140167736A1公开(公告)日： 2014-06-19
- 发明人: Kenji Suzuki , Hideto Imajo , Daigo Takagi
- 申请人： Kenji Suzuki , Hideto Imajo , Daigo Takagi
- 申请人地址： JP Tokyo
- 专利权人： ASAHI KASEI MICRODEVICES CORPORATION
- 当前专利权人： ASAHI KASEI MICRODEVICES CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-154658 20110713; JP2012-114392 20120518
- 国际申请： PCT/JP2012/004488 WO 20120711
- 主分类号： G01R15/14
- IPC分类号： G01R15/14
摘要：
It is intended to reduce manufacturing cost in a current sensor including a primary conductor having a U-shaped current path. A current sensor includes a primary conductor having a U-shaped current path, a support portion for supporting a magneto-electric conversion element, and a lead terminal connected to the support portion, and wherein the current path is not overlapped with the support portion in a plan view, while being formed so as to have a height different from that of the support portion in a side view.
公开/授权文献
- US09448256B2 Current sensor substrate and current sensor 公开/授权日：2016-09-20
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