发明申请
- 专利标题: HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 热辐射基板及其制造方法
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申请号: US14061266申请日: 2013-10-23
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公开(公告)号: US20140174794A1公开(公告)日: 2014-06-26
- 发明人: Joon Seok KANG , Kwang Jik Lee , Sang Hyun Shin , Hye Suk Shin
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2012-0150692 20121221
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; C25D11/02
摘要:
A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material.
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