A fabrication method of a semiconductor package is provided, which includes the steps of: providing a carrier having an adhesive layer and at least a semiconductor element having a protection layer; disposing the semiconductor element on the adhesive layer of the carrier through the protection layer; forming an encapsulant on the adhesive layer of the carrier for encapsulating the semiconductor element; removing the carrier and the adhesive layer to expose the protection layer from the encapsulant; and removing the protection layer to expose the semiconductor element from the encapsulant. Since the semiconductor element is protected by the protection layer against damage during the process of removing the adhesive layer, the product yield is improved.