发明申请
- 专利标题: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY
- 专利标题(中): 制造半导体器件,块状堆叠体和顺序堆叠体的方法
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申请号: US14239960申请日: 2012-08-24
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公开(公告)号: US20140183758A1公开(公告)日: 2014-07-03
- 发明人: Kensuke Nakamura , Toru Meura , Yoji Ishimura
- 申请人: Kensuke Nakamura , Toru Meura , Yoji Ishimura
- 申请人地址: JP Tokyo
- 专利权人: SUMITOMO BAKELITE CO., LTD.
- 当前专利权人: SUMITOMO BAKELITE CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-182424 20110824; JP2011-190280 20110901
- 国际申请: PCT/JP2012/071469 WO 20120824
- 主分类号: H01L25/00
- IPC分类号: H01L25/00 ; H01L25/065
摘要:
A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.