Invention Application
- Patent Title: ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 电子元件及其制造方法
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Application No.: US14144384Application Date: 2013-12-30
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Publication No.: US20140185188A1Publication Date: 2014-07-03
- Inventor: Moon IL KIM , Byoung Hwa LEE , Doo Hwan LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0158338 20121231
- Main IPC: H01G4/008
- IPC: H01G4/008

Abstract:
Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser.
Public/Granted literature
- US09543076B2 Electronic component and method of manufacturing the same Public/Granted day:2017-01-10
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