Invention Application
- Patent Title: BONDING ASSEMBLY
- Patent Title (中): 连接总成
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Application No.: US14198936Application Date: 2014-03-06
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Publication No.: US20140186100A1Publication Date: 2014-07-03
- Inventor: Henry E. Richardson , Jeffery Thomas Shantz , Alex Mangiapane
- Applicant: Zephyros, Inc.
- Main IPC: F16B17/00
- IPC: F16B17/00
Abstract:
A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.
Public/Granted literature
- US09303670B2 Bonding assembly Public/Granted day:2016-04-05
Information query
