Invention Application
- Patent Title: MODULE FOR PACKAGES
- Patent Title (中): 包装模块
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Application No.: US13749220Application Date: 2013-01-24
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Publication No.: US20140203693A1Publication Date: 2014-07-24
- Inventor: Chet R. Wisniewski , Spencer W. Chamberlain
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Main IPC: A47B51/00
- IPC: A47B51/00 ; A47B46/00 ; A47B96/20

Abstract:
One variation may include a method including providing a module for packaging, delivering and displaying goods in the module, the module including at least one face which may be removed, retracted or moved to display goods prepackaged in the module, packaging a plurality of goods in the module, delivering the module to a factory, office, hospital, warehouse or retail store, removing, retracting or moving a face of the module to display the goods prepackaged in the module. Another variation may include a module including the elevator floor system and at least one sensor for determining the height of stacked packages within the module.
Information query