Invention Application
- Patent Title: SEMICONDUCTOR LIGHT EMITTING ELEMENT
- Patent Title (中): 半导体发光元件
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Application No.: US14167016Application Date: 2014-01-29
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Publication No.: US20140209938A1Publication Date: 2014-07-31
- Inventor: Keiji EMURA , Akihiro MIYAGI , Shun KITAHAMA
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2013-014932 20130130; JP2013-091224 20130424; JP2013-203610 20130930
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L27/15

Abstract:
A semiconductor light emitting element includes: an insulating substrate having a plurality of convex portions on a surface thereof; a plurality of light emitting element components having semiconductor laminated bodies that are laminated on the insulating substrate and are separated from one another by a groove that exposes the convex portions; and a connector connecting between the light emitting element components. The light emitting element components include a first light emitting element component and a second light emitting element component. The first light emitting element component is separated from the second light emitting element component with the groove in between, and has a first protrusion that protrudes toward the second light emitting element component. The connector includes a first connector having a shape that straddles the groove and that follows the convex portions, and has a straight section.
Public/Granted literature
- US09041039B2 Semiconductor light emitting element Public/Granted day:2015-05-26
Information query
IPC分类: