The invention relates to a method for bonding a thermoplastic polymer to a thermosetting polymer component, the thermoplastic polymer having a melting temperature that exceeds the curing temperature of the thermosetting polymer. The method comprises the steps of providing a cured thermosetting polymer component comprising an implant of a thermoplastic polymer at least at the part of the thermosetting polymer component to be bonded, locating a thermoplastic polymer in contact with at least the part to be bonded, heating the assembly to the melting temperature of the thermoplastic polymer, whereby the thermoplastic polymer of the implant melts and fuses with the thermoplastic polymer, and cooling the assembly. The thermoplastic polymer has a melting temperature that exceeds the curing temperature of the thermosetting polymer, and the implant is designed such that heating above the maximum operating temperature of the thermosetting polymer at the interface of the implant with the thermosetting polymer component is avoided during the bonding step.