Invention Application
- Patent Title: EPOXY-CONTAINING POLYSILOXANE OLIGOMER COMPOSITIONS, PROCESS FOR MAKING SAME AND USES THEREOF
- Patent Title (中): 含环氧多羟基低聚物组合物,其制备方法及其用途
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Application No.: US14247645Application Date: 2014-04-08
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Publication No.: US20140221531A1Publication Date: 2014-08-07
- Inventor: Narayana Padmanabha Iyer , Lesley Hwang , Vikram Kumar , Christian Geismann , Constantine Kondos , Shiu-Chin Su
- Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
- Applicant Address: US NY WATERFORD
- Assignee: MOMENTIVE PERFORMANCE MATERIALS INC.
- Current Assignee: MOMENTIVE PERFORMANCE MATERIALS INC.
- Current Assignee Address: US NY WATERFORD
- Main IPC: C09D7/12
- IPC: C09D7/12

Abstract:
The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.
Public/Granted literature
- US09243152B2 Epoxy-containing polysiloxane oligomer compositions, process for making same and uses thereof Public/Granted day:2016-01-26
Information query