A chip package is described. This chip package includes a housing having a surface and a cavity, defined by an edge in the surface, with slots arranged at an angle relative to the surface. For example, the angle may be between 0° (in a plane of the surface) and 90° (perpendicular to the plane). Alternatively, the angle may be 0°. Moreover, the slots may be configured to accommodate a set of semiconductor dies arranged in a stack along a direction perpendicular to a plane of the slots, and the semiconductor dies may be offset from each other in a horizontal direction in the plane of slots so that one side of the stack defines a stepped terrace.