Invention Application
- Patent Title: FLEXIBLE CIRCUIT BOARD AND GROUND LINE STRUCURE
- Patent Title (中): 柔性电路板和接地线结构
-
Application No.: US13792243Application Date: 2013-03-11
-
Publication No.: US20140231121A1Publication Date: 2014-08-21
- Inventor: Yu-Chang Pai
- Applicant: NOVATEK MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Priority: TW102105900 20130220
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09

Abstract:
A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern. The ground line structure units include a plurality of ground line edge segments, a ground line middle segment and a plurality of ground line connecting segments. The ground line edge segments define an edge shape of each ground line structure unit. The edge shape of each ground line structure unit is a hexagon. The ground line connecting segments are configured to connect the ground line middle segment and the ground line edge segments. The ground line edge segments, the ground line middle segment and the ground line connecting segments form a plurality of pentagonal electrode structures within the hexagonal ground line structure unit. A flexible circuit board including the ground line structure is also provided.
Public/Granted literature
- US08941012B2 Flexible circuit board and ground line structure Public/Granted day:2015-01-27
Information query