Invention Application
- Patent Title: SUSPENSION MOULDS
- Patent Title (中): 暂停模式
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Application No.: US14241844Application Date: 2011-09-26
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Publication No.: US20140231617A1Publication Date: 2014-08-21
- Inventor: Wusheng Wang
- Applicant: Wusheng Wang
- Applicant Address: US DE Wilmington
- Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee Address: US DE Wilmington
- International Application: PCT/CN2011/080160 WO 20110926
- Main IPC: B29C33/30
- IPC: B29C33/30

Abstract:
The present disclosure generally describes a mould support structure. In some embodiments, a mould support structure can include a supporting member, a suspending member connected to the supporting member, and a moulding board connected to the suspending member. The supporting member can be configured to support the moulding board via the suspending member while the supporting member is positioned at least partially above the moulding board.
Information query