Invention Application
- Patent Title: POLYAMIDE COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY
- Patent Title (中): 具有高导热性的聚酰胺组合物
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Application No.: US14347843Application Date: 2012-09-25
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Publication No.: US20140235770A1Publication Date: 2014-08-21
- Inventor: Yeong-Chool Yu , Tae-Kyun Kim
- Applicant: RHODIA OPERATIONS
- Applicant Address: FR Aubervilliers
- Assignee: RHODIA OPERATIONS
- Current Assignee: RHODIA OPERATIONS
- Current Assignee Address: FR Aubervilliers
- Priority: FR1158628 20110927
- International Application: PCT/EP2012/068837 WO 20120925
- Main IPC: H01B3/30
- IPC: H01B3/30
Abstract:
The present invention relates to a composition containing a polyamide matrix having high thermal conductivity, and including a nitride and a metal oxide, as well as, optionally, a flame-retardant system. Said composition can be used in particular for producing components for lighting apparatuses including light-emitting diodes.
Public/Granted literature
- US09922749B2 Polyamide composition having high thermal conductivity Public/Granted day:2018-03-20
Information query
