Invention Application
- Patent Title: CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Patent Title (中): 芯片布置和制造芯片布置方法
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Application No.: US13779832Application Date: 2013-02-28
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Publication No.: US20140239474A1Publication Date: 2014-08-28
- Inventor: Frank Pueschner , Juergen Hoegerl , Roman Hollweck , Peter Scherl
- Applicant: INFINEON TECHNOLOGIES AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/50
Abstract:
In various embodiments a chip arrangement is provided, wherein the chip arrangement may include a chip and at least one foil attached to at least one side of the chip.
Public/Granted literature
- US09224695B2 Chip arrangement and a method for manufacturing a chip arrangement Public/Granted day:2015-12-29
Information query
IPC分类:
