发明申请
- 专利标题： TWO MASK PROCESS FOR ELECTROPLATING METAL EMPLOYING A NEGATIVE ELECTROPHORETIC PHOTORESIST
- 专利标题（中）： 用于电镀金属的两个掩模工艺使用负极电泳光电
-
申请号： US13584326申请日： 2012-08-13
-
公开(公告)号： US20140242524A1公开(公告)日： 2014-08-28
- 发明人: Gareth G. Hougham , Gerard McVicker , Anna Pratt
- 申请人： Gareth G. Hougham , Gerard McVicker , Anna Pratt
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; G03F7/40
摘要：
A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.