发明申请
- 专利标题： CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD
- 专利标题（中）： 电路板和电路板的制造方法
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申请号： US14129408申请日： 2012-07-02
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公开(公告)号： US20140251659A1公开(公告)日： 2014-09-11
- 发明人: Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
- 申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
- 申请人地址： JP Aichi-ken
- 专利权人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- 当前专利权人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- 当前专利权人地址： JP Aichi-ken
- 优先权： JP2011-150265 20110706
- 国际申请： PCT/JP2012/066900 WO 20120702
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/30 ; H05K1/09 ; H05K3/00 ; H05K1/02 ; H05K1/18
摘要：
A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.
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