发明申请
- 专利标题： IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS
- 专利标题（中）： 内置电阻和屏蔽元件
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申请号： US14169747申请日： 2014-01-31
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公开(公告)号： US20140252670A1公开(公告)日： 2014-09-11
- 发明人: Ronald H. Haag , Jeffrey R. Engel , William W. Boddie, JR.
- 申请人： T-Ink, Inc.
- 申请人地址： US NY New York
- 专利权人： T-Ink, Inc.
- 当前专利权人： T-Ink, Inc.
- 当前专利权人地址： US NY New York
- 主分类号： H01H11/04
- IPC分类号： H01H11/04
摘要：
An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
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