发明申请
US20140254642A1 Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface 有权
高带宽芯片到芯片通信接口的方法和系统

Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface
摘要:
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
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