发明申请
- 专利标题: Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface
- 专利标题(中): 高带宽芯片到芯片通信接口的方法和系统
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申请号: US14199960申请日: 2014-03-06
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公开(公告)号: US20140254642A1公开(公告)日: 2014-09-11
- 发明人: John Fox , Brian Holden , Ali Hormati , Peter Hunt , John D. Keay , Amin Shokrollahi , Richard Simpson , Anant Singh , Andrew Kevin John Stewart , Giuseppe Surace , Roger Ulrich
- 申请人: Kandou Labs, SA
- 申请人地址: CH Lausanne
- 专利权人: Kandou Labs, SA
- 当前专利权人: Kandou Labs, SA
- 当前专利权人地址: CH Lausanne
- 主分类号: H04L25/02
- IPC分类号: H04L25/02
摘要:
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
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