发明申请
- 专利标题: METHOD OF FORMING A SEMICONDUCTOR STRUCTURE INCLUDING AN IMPLANTATION OF IONS INTO A LAYER OF SPACER MATERIAL
- 专利标题(中): 形成半导体结构的方法,包括将离子植入到间隔材料层中
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申请号: US13793082申请日: 2013-03-11
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公开(公告)号: US20140256137A1公开(公告)日: 2014-09-11
- 发明人: Ralf Richter , Jan Hoentschel , Sven Beyer , Peter Javorka
- 申请人: GLOBALFOUNDRIES INC.
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人地址: KY Grand Cayman
- 主分类号: H01L21/265
- IPC分类号: H01L21/265
摘要:
A method includes providing a semiconductor structure including a substrate and a transistor element. A layer of a spacer material is deposited over the substrate and the gate structure, wherein the deposited layer of spacer material has an intrinsic stress. Ions are implanted into the layer of spacer material. After the deposition of the layer of spacer material and the implantation of ions into the layer of spacer material, a sidewall spacer is formed at sidewalls of the gate structure from the layer of spacer material.
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