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发明申请
US20140264839A1 Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices 有权
封装半导体器件，封装半导体器件和PoP器件的方法

Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
摘要：
Packaged semiconductor devices, methods of packaging semiconductor devices, and package-on-package (PoP) devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming through-package vias (TPVs) over a carrier, and coupling a semiconductor device to the carrier. The semiconductor device includes contact pads disposed on a surface thereof and an insulating material disposed over the contact pads. A molding material is formed over the carrier between the TPVs and the semiconductor device. Openings are formed in the insulating material using a laser drilling process over the contact pads, and a redistribution layer (RDL) is formed over the insulating material and the openings in the insulating material. A portion of the RDL is coupled to a top surface of each of the contact pads.
摘要（中）：

公开了封装半导体器件，封装半导体器件的方法和封装封装（PoP）器件。 在一些实施例中，封装半导体器件的方法包括在载体上形成贯穿封装通孔（TPV），以及将半导体器件耦合到载体。 半导体器件包括设置在其表面上的接触焊盘和设置在接触焊盘上的绝缘材料。 在TPV和半导体器件之间的载体上形成模制材料。 使用在接触焊盘上的激光钻孔工艺在绝缘材料中形成开口，并且在绝缘材料和绝缘材料中的开口上形成再分布层（RDL）。 RDL的一部分耦合到每个接触焊盘的顶表面。

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