Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13922798Application Date: 2013-06-20
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Publication No.: US20140264928A1Publication Date: 2014-09-18
- Inventor: Chun-Tang Lin , Yi-Che Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Priority: TW102108595 20130312
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L21/56 ; H01L23/28
Abstract:
A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an interposer; forming a first encapsulant on the interposer for encapsulating the first semiconductor elements; disposing a plurality of second semiconductor elements on the first semiconductor elements; forming a second encapsulant on the first semiconductor elements and the first encapsulant for encapsulating the second semiconductor elements; and thinning the interposer, thereby reducing the overall stack thickness and preventing warpage of the interposer.
Public/Granted literature
- US09324582B2 Semiconductor package and fabrication method thereof Public/Granted day:2016-04-26
Information query
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