Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE HAVING APERTURE ANTENNA
- Patent Title (中): 具有孔径天线的半导体结构
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Application No.: US13834424Application Date: 2013-03-15
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Publication No.: US20140266947A1Publication Date: 2014-09-18
- Inventor: Chi-Han Chen , Chi-Tsung Chiu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H01Q1/38
Abstract:
The semiconductor package includes a first substrate having a first surface and a second surface opposite to the first surface. A circuit portion is formed on the first surface of the substrate, wherein the circuit portion includes a wave guiding slot and a microstrip line overlapping the wave guiding slot. A chip is disposed on the circuit portion. An antenna is formed on the second surface of the substrate, wherein the antenna overlaps the wave guiding slot.
Public/Granted literature
- US09172131B2 Semiconductor structure having aperture antenna Public/Granted day:2015-10-27
Information query
