Invention Application
- Patent Title: POST-MOLD SYSTEM
- Patent Title (中): 后模系统
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Application No.: US14354640Application Date: 2012-10-17
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Publication No.: US20140271963A1Publication Date: 2014-09-18
- Inventor: William Steven Keir , Allan King Leung Lee , Darrin Albert Macleod , Peter Yankov , Raymond Weiping Zhang
- Applicant: Husky Injection Molding Systems Ltd.
- International Application: PCT/CA2012/050733 WO 20121017
- Main IPC: B29C35/00
- IPC: B29C35/00

Abstract:
Disclosed herein, amongst other things, is a post-mold system (100, 200, 300, 400, 500) for conditioning a molded article (130). The post-mold system comprises a retrieval device (110, 210, 310, 410, 510) having a receptacle (112, 212, 312, 412, 512) that is configured to retrieve the molded article (130) from a mold (132) and a conditioning device (120, 320, 420, 520). The receptacle (112, 212, 312, 412, 512) is configured to be selectively transferrable between the retrieval device (110, 210, 310, 410, 510) and the conditioning device (120, 320, 420, 520). The conditioning device (120, 320, 420, 520) includes a first thermal regulator (140, 240, 440) that is configured to thermally regulate the receptacle (112, 212, 312, 412, 512) when connected thereto.
Public/Granted literature
- US09895829B2 Post-mold system Public/Granted day:2018-02-20
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