A device for applying a two-part adhesive to a substrate includes a carrier, a first tray coupled to the carrier, a first package disposed in the first tray, and a second package disposed in the first tray. The first package contains a first part of the two-part adhesive and the second package contains a second part of the two-part adhesive. The device further includes a applicator that is in communication with the first package and the second package. The applicator is configured to receive the first part and the second part and mix the first part and the second part to form the two-part adhesive. The device also includes a second tray coupled to the carrier and configured to accommodate a power supply that provides electrical power to operate the device.