The present invention provides a polishing film with which, even when water containing impurity ions is used as a polishing liquid, the abrasive particles comprising SiO2 are less apt to adhere to the polished surface, e.g., the polished surface of an end of an optical fiber itself, and which is less apt to cause the optical loss attributable to scratches or edge chips in the polished surface. The polishing film hence renders good finish-polishing quality possible. This polishing film is characterized by comprising a substrate and an abrasive layer which has been disposed on a surface of the substrate and which comprises abrasive particles comprising SiO2, a binder resin, and an adhesion inhibitor containing a phosphorus compound.