Invention Application
- Patent Title: HIGH CURRENT POWER INDUCTOR
- Patent Title (中): 高功率电感器
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Application No.: US14217705Application Date: 2014-03-18
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Publication No.: US20140313003A1Publication Date: 2014-10-23
- Inventor: Zhuomin Liu , Robert James Bogert
- Applicant: COOPER TECHNOLOGIES COMPANY
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F27/255

Abstract:
A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.
Public/Granted literature
- US09558881B2 High current power inductor Public/Granted day:2017-01-31
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