Invention Application
- Patent Title: COOLING APPARATUS
- Patent Title (中): 冷却装置
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Application No.: US14255212Application Date: 2014-04-17
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Publication No.: US20140313672A1Publication Date: 2014-10-23
- Inventor: Juha TUOMOLA
- Applicant: ABB Oy
- Applicant Address: FI Helsinki
- Assignee: ABB Oy
- Current Assignee: ABB Oy
- Current Assignee Address: FI Helsinki
- Priority: EP13164229.0 20130418
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into channels, a first and a second connecting part for providing a flow path between the channels of the pipes, a first heat transfer element having a first base plate with a first surface for receiving a heat load from one or more electric components and for transferring the heat load to a fluid, and a second heat transfer element. In order to obtain an efficient apparatus at least one first pipe that is at a location of an electric component is at least partly embedded in the first base plate via a second surface of the first base plate, while the pipes which are not at the location of an electric component are not embedded in the first base plate.
Public/Granted literature
- US09392729B2 Cooling apparatus Public/Granted day:2016-07-12
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