发明申请
- 专利标题： APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANCING AND CONTACT SENSING
- 专利标题（中）： 半导体波浪平衡，力平衡和接触感应的装置和方法
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申请号： US14330536申请日： 2014-07-14
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公开(公告)号： US20140318683A1公开(公告)日： 2014-10-30
- 发明人: HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
- 申请人： HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
- 申请人地址： DE Garching
- 专利权人： SUSS MICROTEC LITHOGRAPHY, GMBH
- 当前专利权人： SUSS MICROTEC LITHOGRAPHY, GMBH
- 当前专利权人地址： DE Garching
- 主分类号： H01L21/68
- IPC分类号： H01L21/68
摘要：
A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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