发明申请
- 专利标题： MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
- 专利标题（中）： 制造多层微结构
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申请号： US14326806申请日： 2014-07-09
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公开(公告)号： US20140322436A1公开(公告)日： 2014-10-30
- 发明人: Hwei-Ling Yau , David Pau Trauernicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok
- 申请人： Hwei-Ling Yau , David Pau Trauernicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok
- 主分类号： H05K3/46
- IPC分类号： H05K3/46
摘要：
A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
公开/授权文献
- US09226411B2 Making multi-layer micro-wire structure 公开/授权日：2015-12-29
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