Invention Application
- Patent Title: CAPACITOR ELEMENT MOUNTING STRUCTURE AND CAPACITOR ELEMENT MOUNTING METHOD
- Patent Title (中): 电容器元件安装结构和电容元件安装方法
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Application No.: US14270403Application Date: 2014-05-06
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Publication No.: US20140332261A1Publication Date: 2014-11-13
- Inventor: Isamu FUJIMOTO , Kazuo HATTORI
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-shi
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP2013-100588 20130510; JP2014-038758 20140228
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30

Abstract:
A circuit board includes a wiring board on which is mounted first and second laminated ceramic capacitors near or adjacent to each other, arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and electrically connected in series or in parallel via a conductive pattern provided on the wiring board. One width direction side surface of the first laminated ceramic capacitor and one length direction end surface of the second laminated ceramic capacitor oppose each other perpendicularly or approximately perpendicularly.
Public/Granted literature
- US09277647B2 Capacitor element mounting structure and capacitor element mounting method Public/Granted day:2016-03-01
Information query