发明申请
- 专利标题： DUAL-SIDE WAFER BAR GRINDING
- 专利标题（中）： 双面砂轮研磨
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申请号： US13897701申请日： 2013-05-20
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公开(公告)号： US20140341796A1公开(公告)日： 2014-11-20
- 发明人: Jianmin Wang , Serapion C. Daof , Senghong Chua , Meng Lee
- 申请人： Veeco Instruments, Inc.
- 申请人地址： US NY Plainview
- 专利权人： Veeco Instruments, Inc.
- 当前专利权人： Veeco Instruments, Inc.
- 当前专利权人地址： US NY Plainview
- 主分类号： B24B19/26
- IPC分类号： B24B19/26
摘要：
A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.