Invention Application
- Patent Title: CONDUCTIVE PASTE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Patent Title (中): 导电胶片电子元件及制造电子元件的方法
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Application No.: US14457167Application Date: 2014-08-12
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Publication No.: US20140347783A1Publication Date: 2014-11-27
- Inventor: Tetsuya Kisumi , Toshiki Nagamoto , Yasuhiro Nishisaka , Yoko Okabe
- Applicant: MURATA MANUFACTURING CO., LTD.
- Priority: JP2012-043729 20120229
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/012 ; H01B1/16 ; H01G4/30

Abstract:
A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO2 in the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiO2 in a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 μm or less.
Public/Granted literature
- US09653211B2 Conductive paste, electronic component and method for manufacturing electronic component Public/Granted day:2017-05-16
Information query